255nm Laser Decapsulation Machine for Non-Destructive IC Failure Analysis

Unlock a new level of precision and reliability in your Integrated Circuit (IC) failure analysis with our state-of-the-art Laser Decapsulation Machine. Engineered for the modern lab, this system replaces traditional, destructive methods with a clean, controlled, and non-destructive process that keeps the chip alive and fully functional for direct observation.

See the Failure, Not Just an Image

Traditional methods like X-ray or infrared imaging provide indirect data. Our decapsulator allows you to see the failure site directly under a microscope, on a chip that is still powered and operational. Move from inference to certainty.

Key Features & Benefits:

• True Non-Destructive Decapsulation: Our unique 255nm laser, combined with a proprietary photochemical solvent, precisely ablates the epoxy mold compound. It effectively removes the resin while preserving the delicate silicon die, bond wires, and microstructures underneath.
• Analyze “Live” Chips: Unlike acid-based or mechanical methods that kill the device, our process allows the chip to remain fully functional post-decapsulation. Power it up and probe it while observing the exact failure location in real-time.
• Patented Photochemical Process: The 255nm laser wavelength is optimally tuned to activate a specialized, non-toxic, and eco-friendly solvent. This reaction ensures a clean and selective removal of the packaging material without damaging the silicon.
• Unmatched Precision & Repeatability: With 10W of electrical power and advanced software control, achieve highly consistent and repeatable results across every batch. Eliminate human error and ensure every decapsulation meets your exact specifications.
• Complete Automation & Documentation: The integrated software suite includes user management, photochemical recipe management, and automatic time-lapse video recording. Automatically document the entire process from start to finish for full traceability and reporting.
• Built with Safety and Compliance: Designed for the professional laboratory. This system is CE Certified for quality and complies with CDRH Class I Laser Safety Standards, ensuring a safe operating environment.

Ideal For:

• Semiconductor Failure Analysis (FA) Labs
• Quality Assurance & Reliability Engineering
• Research & Development Centers
• Forensic Engineering and Counterfeit Component Analysis

Technical Specifications:

• Laser Wavelength: 255 nm
• Electrical Power: 10 W
• Process Type: Photochemical Decapsulation
• Safety Standards: CDRH Class I, CE Certification
• Solvent: Non-Toxic, Green Formula
• Software Features:
  • User Access Management
  • Customizable Recipe Management
  • Automatic Time-Lapse Video & Photo Capture
  • High-Repeatability Automation

Stop guessing and start seeing. Transform your failure analysis capabilities with the precision and reliability of our 255nm Laser Decapsulation System.

Contact us today for a quote or to schedule a demo!