LMS is a micromachining platform based on ultrafast laser technology with a dual-beam optical architecture.
By combining galvanometer scanning and Bessel-beam cutting beam delivery design, the system is capable of high-precision subtractive processing and micron-scale cutting applications.

LMS is well suited for a wide range of advanced micromachining processes, including:

• Microfluidic chip fabrication
• Through-hole and blind-hole drilling, as well as repair, on wafers and glass substrates
• Medical ceramic micromachining
• Thin-film processing and hard-metal machining
• PVD/CVD diamond blade and tool processing

Dual beam delivery paths are designed with a long depth of focus, making the system highly tolerant to Z-axis positioning and fixturing variations. This design ensures consistent machining quality and enables high-yield output for small-batch production.

Laser Configurations

LMS is available with two standard laser configurations, and can also be customized with customer-specified laser sources and system components.

40 W, 1064 nm IR femto Laser

• Minimum pulse duration: 400 fs
• Maximum pulse energy: 80 µJ
• Repetition rate: 25 kHz – 5 MHz

This configuration is optimized for athermal internal processing of wafers, glass, and ceramics, including self-focusing bulk drilling and non-destructive material modification.

    10 W, 355 nm UV pico Laser

• Minimum pulse duration: 15 ps
• Maximum pulse energy: 20 µJ
• Repetition rate: 1 – 2 MHz

This configuration is ideal for ultra-precision surface micromachining, such as cutting and patterning of PI, ABF, BT, and coverlay materials, as well as PCB and IC substrates and Micro-LED backplanes.
It is also suitable for micro-cutting of advanced packaging layers, including RDL (Redistribution Layers).

Contact us today to request a quotation or schedule a system demonstration.